Quid sunt opus ad medium processionis in semiconductor processionis componentibus?

1. Clear: Processing of Semiconductor component needs to be carried out in a dustless workshop, which requires extremely high cleanliness levels. Numero particularum pulveris in laboratorio stricto controlletur inter quaecumque intervallo ut non possit pulverem contaminare et detrahere componentes semiconductores. Different levels of cleanliness are applicable to different production processes, such as laboratories, research and development institutions, and ultra clean production areas. Temperatura et humilitate: processione componentes semiiconductorum etiam necessitates precisas habet temperaturam et humilitatem ambientis. Usually, temperature should be controlled within a certain range, while humility should be avoided from being too high or too low. Excessive humility may cause surface contamination of transistors, affecting efficiency; However, low humility can cause static electricity on the surface of the chip, leading to circuit damage. Therefore, ensuring a suitable temperature and humidity environment is crucial for ensuring the quality and performance of semiconductor components Pressure et puritate gasae: In processo semiconductoris componentium processionis, diversa gasa, sicut nitrogen, oxygenum, hydrogenum etc., opus est. At the same time, the cleanness of the gas is also crucial to avoid adverse effects of impurities in the gas on semiconductor components Static control: The semiconductor component processing environment has extremely strict requirements for static electricity. Static electricity may cause damage to CMOS integration, so effective electrostatic protection measures must be taken in the workshop, such as using anti-static materials and regularly cleaning equipment Other parameters: In addition to the above requirements, the semiconductor component processing environment also needs to control other parameters, such as illumination, clean room cross-sectional wind speed, etc., to ensure the smooth progress of the processing process and stable quality of the parts.