1. Cleanliness: Semiconductor component processing needs to be carried out in a dust-free workshop, which requires extremely high cleanliness levels. The number of dust particles in the workshop must be strictly controlled within a certain range to prevent dust from contaminating and damaging semiconductor components. Different cleanliness levels are applicable to different production processes, such as laboratories, research and development institutions, and ultra clean production areas. Temperature and humidity: Semiconductor component processing also has precise requirements for the temperature and humidity of the environment. Usually, temperature should be controlled within a certain range, while humidity should be avoided from being too high or too low. Excessive humidity may cause surface contamination of transistors, affecting efficiency; However, low humidity may cause static electricity on the surface of the chip, leading to circuit damage. Therefore, ensuring a suitable temperature and humidity environment is crucial for ensuring the quality and performance of semiconductor components Pressure and gas cleanliness: In the process of semiconductor component processing, various gases such as nitrogen, oxygen, hydrogen, etc. need to be used. The pressure of these gases needs to be precisely controlled to ensure the stability of the machining process and the quality of the parts. At the same time, the cleanliness of the gas is also crucial to avoid adverse effects of impurities in the gas on semiconductor components Static control: The semiconductor component processing environment has extremely strict requirements for static electricity. Static electricity may cause damage to CMOS integration, so effective electrostatic protection measures must be taken in the workshop, such as using anti-static materials and regularly cleaning equipment Other parameters: In addition to the above requirements, the semiconductor component processing environment also needs to control other parameters, such as illumination, clean room cross-sectional wind speed, etc., to ensure the smooth progress of the processing process and stable quality of the parts.


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