What are the cutting methods for analyzing semiconductor component processing?

Semiconductor component processing is a complex and intricate process that involves multiple key steps and technologies. The cutting methods in semiconductor component processing mainly include the following: ⑴ Blade cutting · Full cutting: Fully cutting the workpiece by cutting to a fixed material (such as cutting tape) is a basic processing method in semiconductor manufacturing· Half cut: Cutting into the middle of the workpiece to create a groove, commonly used in DBG technology for thinning and chip separation through grinding. · Double cutting: Use a double cutting saw to simultaneously perform full or half cutting on two lines to increase production· Step by step cutting: using a dual cutting machine with two main axes to perform full cutting and half cutting in two stages, commonly used for processing wiring layers· Diagonal cutting: During the step-by-step cutting process, a blade with a V-shaped edge on the semi cutting side is used to cut the wafer in two stages, achieving high mold strength and high-quality processing· Chopper cutting: The blade descends from directly above the workpiece and cuts vertically into the workpiece, commonly used for local slotting· Horizontal movement of chopper: During the chopper cutting process, the workpiece is horizontally moved to cut, suitable for partial cutting· Circular cutting: After being cut by the shredder, the workpiece is cut into a circular shape by rotating the processing table. Tilt cutting (tilt angle spindle): By installing a tilted spindle on the machining table to achieve cutting at a certain angle, it is used for processes that require angle cutting Laser cutting: The use of laser technology to separate wafers into grains involves delivering a high concentration of photon flow onto the wafer, generating local high temperatures to remove the cutting channel area· The cost of laser cutting is relatively high, but it can achieve high-precision and high-efficiency processing Micro cutting machining utilizes high-resolution solid micro cutting tools to remove workpiece allowance through mechanical force on precision and ultra precision cutting machines· The processing materials are extensive, the processing shapes are complex, and the processing accuracy is high. The processing shapes mainly rely on cutting tools and machine tools to ensure Outer circle cutting: Using earlier cutting methods, cutting is formed by high-speed rotation of the blade in contact with the silicon ingot· Due to the limitations of the clamping method and blade stiffness of the outer circular blade, the cutting accuracy and flatness have been reduced, gradually replaced by other methods. The above cutting methods each have their own characteristics and are suitable for different semiconductor component processing needs. In practical applications, it is necessary to select appropriate cutting methods based on specific machining requirements and conditions.